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Aluminum Chip Hot Melt Glue For Edge Banding Ivory Clear Sticks PUR-XCS637
Product Details:
| Place of Origin: | CHINA |
| Brand Name: | WANLI-ADHESION |
| Certification: | ISO9001 ISO14001 IATF16949 |
| Model Number: | PUR-XCS637 |
Payment & Shipping Terms:
| Minimum Order Quantity: | 20 KG |
|---|---|
| Packaging Details: | 500~2000g/Bag, 20Kg/Barrel, 200Kg/Barrel |
| Delivery Time: | 5-8 work days |
| Payment Terms: | L/C, T/T |
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Detail Information |
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| Product: | PUR Hot Melt Adhesive | Component: | PUR(Polyurethane) |
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| Appearance: | Ivory Solid | Solid Content: | 100 % |
| Shelf Life: | 6Months | Melt Viscosity: | About 55000mPa·s@120℃ |
| Operating Temperature: | 130±10 ℃ | Open Time: | 10~15s@25℃ |
| Useage Scope: | Edge Bonding Of Wood Material S- Chip Board | Application Industry: | Woodworking Edgebanding |
| High Light: | aluminum hot melt glue for edge banding,chip hot melt glue for edge banding,ivory clear hot melt glue sticks |
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Product Description
Factory Directly Supply Ivory-White Solid Moisture-Curing Reactive PUR Hot Melt Adhesive WANLI® PUR-XCS637 with Operating Temperature 130±10℃ for Edge Bonding of Various Kinds of Substrates to Various Kinds of Surface Materials
Wanli® PUR hot melt adhesive PUR-XCS637 for edge bonding is a single-component reactive PUR hot melt adhesive with 100% solid content. PUR-XCS637 is a translucent natural color edge bonding glue, which is mainly used for edge bonding of solid wood materials, density boards, foam boards, particleboards and other substrates. PUR-XCS637 is featured high initial tack, short open time, high bond strength.
APPLICATION
Wanli® PUR hot melt adhesive PUR-XCS637 is used for edge bonding. PUR-XCS637 is mainly used edge bonding of solid wood materials, density boards, foam boards, particleboards and other substrates.
| Application Material | Woodworking Edgebanding Hot Melt Adhesives |
| Appearance | Ivory Solid |
| Component | PUR(Polyurethane) |
| Application Industry | Woodworking Edgebanding |
| Solid Content | 100 % |
| Operating Temperature | 130±10 ℃ |
| Melt Viscosity | About 55000mPa·s@120℃(Brookfield-ASTMD3236) |
| Open Time | 10~15s@25℃ |
| Usage Scope | Edge Bonding of Wood Materials - Chip Board |
| Shelf Life | 6Months |
| Package | 500~2000g/Bag, 20Kg/Barrel, 200Kg/Barrel |
FEATURE
High initial tack.
Short open time.
High bond strength.
USER GUIDE
The package of PUR-XCS637 is suitable for various dispensing equipment.
The recommended operating temperature is 120℃~140℃.
In order to achieve complete curing, it is better to place finished product in a working environment with suitable temperature and humidity (recommended temperature: 23~25℃, about 55% relative humidity).
STORAGE
Dry, cool, avoid direct sunlight, no more than 35℃.
