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Chip Edgebanding Low Temperature Hot Melt Glue White Polypropylene PUR-XBB768
Product Details:
| Place of Origin: | CHINA |
| Brand Name: | WANLI-ADHESION |
| Certification: | ISO9001 ISO14001 IATF16949 |
| Model Number: | PUR-XBB768 |
Payment & Shipping Terms:
| Minimum Order Quantity: | 20 KG |
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| Packaging Details: | 2Kg/Bag, 18Kg/Barrel, 20Kg/Barrel, 200Kg/Barrel |
| Delivery Time: | 5-8 work days |
| Payment Terms: | L/C, T/T |
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Detail Information |
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| Product: | PUR Hot Melt Adhesive | Component: | PUR (Polyurethane) |
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| Appearance: | Ivory White Solid | Solid Content: | 100% |
| Shelf Life: | 6 Months | Melt Viscosity: | About 55000mPa·s@120℃ |
| Operating Temperature: | 120~140 ℃ | Open Time: | 8~15s@25℃ |
| Useage Scope: | Edge Bonding Of Wood Materials- Chip Board | Application Industry: | Woodworking Edgebanding |
| High Light: | edgebanding low temperature hot melt glue,chip low temperature hot melt glue,white polypropylene hot glue |
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Product Description
Moisture-curing reactive adhesive PUR-XBB768 ensures superior bonding strength and high-quality appearance in edgebanding applications. The quality of the edgebanding is increasingly becoming a key criterion for evaluating the quality of the entire furniture item in high-quality furniture manufacture.
Wanli® PUR hot melt adhesive PUR-XBB768 for edge bonding is a single-component reactive PUR hot melt adhesive with 100% solid content. PUR-XBB768 is mainly used for edge bonding of wood materials, foam boards, and some aluminum substrates. PUR-XBB768 is featured good initial adhesion, suitable opening time, high bonding strength.
APPLICATION
Wanli® PUR hot melt adhesive PUR-XBB768 is used for edge bonding. PUR-XBB768 is mainly used for edge bonding of wood materials, foam boards, and some aluminum substrates.
| Application Material | Woodworking Edgebanding Hot Melt Adhesives |
| Appearance | Ivory White Solid |
| Component | PUR (Polyurethane) |
| Application Industry | Woodworking Edgebanding |
| Solid Content | 100% |
| Operating Temperature | 120~140 ℃( Depend On Machine, Substrate, Environment And Other Conditions) |
| Melt Viscosity | About 55000mPa·s@120℃(Brookfield-ASTMD3236) |
| Open Time | 8~15s@25℃ |
| Usage Scope | Edge Bonding of Wood Materials - Chip Board |
| Shelf Life | 6 Months |
| Package | 2Kg/Bag, 18Kg/Barrel, 20Kg/Barrel, 200Kg/Barrel |
FEATURE
Very good initial adhesion.
Suitable opening time.
High final bonding strength.
USER GUIDE
The package of PUR-XBB768 is suitable for various dispensing equipment.
The recommended operating temperature is 120℃~140℃.
It is better to place finished product in a working environment with suitable temperature and humidity (recommended temperature: 23~25℃, about 55% relative humidity) to achieve complete curing.
STORAGE
Dry, cool, avoid direct sunlight, no more than 35℃.
