Chip Edgebanding Low Temperature Hot Melt Glue White Polypropylene PUR-XBB768
|Place of Origin:||CHINA|
|Certification:||ISO9001 ISO14001 IATF16949|
Payment & Shipping Terms:
|Minimum Order Quantity:||20 KG|
|Packaging Details:||2Kg/Bag, 18Kg/Barrel, 20Kg/Barrel, 200Kg/Barrel|
|Delivery Time:||5-8 work days|
|Payment Terms:||L/C, T/T|
|Product:||PUR Hot Melt Adhesive||Component:||PUR (Polyurethane)|
|Appearance:||Ivory White Solid||Solid Content:||100%|
|Shelf Life:||6 Months||Melt Viscosity:||About 55000mPa·s@120℃|
|Operating Temperature:||120~140 ℃||Open Time:||8~15s@25℃|
|Useage Scope:||Edge Bonding Of Wood Materials- Chip Board||Application Industry:||Woodworking Edgebanding|
edgebanding low temperature hot melt glue,
chip low temperature hot melt glue,
white polypropylene hot glue
Moisture-curing reactive adhesive PUR-XBB768 ensures superior bonding strength and high-quality appearance in edgebanding applications. The quality of the edgebanding is increasingly becoming a key criterion for evaluating the quality of the entire furniture item in high-quality furniture manufacture.
Wanli® PUR hot melt adhesive PUR-XBB768 for edge bonding is a single-component reactive PUR hot melt adhesive with 100% solid content. PUR-XBB768 is mainly used for edge bonding of wood materials, foam boards, and some aluminum substrates. PUR-XBB768 is featured good initial adhesion, suitable opening time, high bonding strength.
Wanli® PUR hot melt adhesive PUR-XBB768 is used for edge bonding. PUR-XBB768 is mainly used for edge bonding of wood materials, foam boards, and some aluminum substrates.
|Application Material||Woodworking Edgebanding Hot Melt Adhesives|
|Appearance||Ivory White Solid|
|Application Industry||Woodworking Edgebanding|
|Operating Temperature||120~140 ℃( Depend On Machine, Substrate, Environment And Other Conditions)|
|Melt Viscosity||About 55000mPa·s@120℃(Brookfield-ASTMD3236)|
|Usage Scope||Edge Bonding of Wood Materials - Chip Board|
|Shelf Life||6 Months|
|Package||2Kg/Bag, 18Kg/Barrel, 20Kg/Barrel, 200Kg/Barrel|
Very good initial adhesion.
Suitable opening time.
High final bonding strength.
The package of PUR-XBB768 is suitable for various dispensing equipment.
The recommended operating temperature is 120℃~140℃.
It is better to place finished product in a working environment with suitable temperature and humidity (recommended temperature: 23~25℃, about 55% relative humidity) to achieve complete curing.
Dry, cool, avoid direct sunlight, no more than 35℃.