Edgebanding Polyurethane Hot Melt Adhesives Foam PUR Hot Glue Particle Chip Density Aluminum PUR-XCS637
|Place of Origin:||CHINA|
|Certification:||ISO9001 ISO14001 IATF16949|
Payment & Shipping Terms:
|Minimum Order Quantity:||20 KG|
|Packaging Details:||500~2000g/Bag, 20Kg/Barrel, 200Kg/Barrel|
|Delivery Time:||5-8 work days|
|Payment Terms:||L/C, T/T|
|Product:||PUR Hot Melt Adhesive||Component:||PUR (Polyurethane)|
|Appearance:||Ivory Solid||Solid Content:||100%|
|Shelf Life:||6 Months||Melt Viscosity:||About 55000mPa·s@120℃|
|Operating Temperature:||120 ~140 ℃||Open Time:||10~15s@25℃|
|Useage Scope:||Edge Bonding Of Wood Material S- Chip Board||Application Industry:||Woodworking Edgebanding|
edgebanding polyurethane hot melt adhesives,
particle polyurethane hot melt adhesives,
foam pur hot glue
Single-component reactive adhesive PUR-XCS637 is colorless transparent after melting and suitable for edgebanding application of all colors substrates. It can cure within short time at room temperature and provide an invisible bondline due to their colorless appearance to meet end customer demands on perfect glueline.
Wanli® PUR hot melt adhesive PUR-XCS637 for edge bonding is a single-component reactive PUR hot melt adhesive with 100% solid content. PUR-XCS637 is a translucent natural color edge bonding glue, which is mainly used for edge bonding of solid wood materials, density boards, foam boards, particleboards and other substrates. PUR-XCS637 is featured high initial tack, short open time, high bond strength.
Wanli® PUR hot melt adhesive PUR-XCS637 is used for edge bonding. PUR-XCS637 is mainly used edge bonding of solid wood materials, density boards, foam boards, particleboards and other substrates.
|Application Material||Woodworking Edgebanding Hot Melt Adhesives|
|Application Industry||Woodworking Edgebanding|
|Operating Temperature||120~140 ℃( Depend On Machine, Substrate, Environment And Other Conditions)|
|Melt Viscosity||About 55000mPa·s@120℃(Brookfield-ASTMD3236)|
|Usage Scope||Edge Bonding of Wood Materials - Chip Board|
|Shelf Life||6 Months|
|Package||500~2000g/Bag, 20Kg/Barrel, 200Kg/Barrel|
High initial tack.
Short open time.
High bond strength.
The package of PUR-XCS637 is suitable for various dispensing equipment.
The recommended operating temperature is 120℃~140℃.
It is better to place finished product in a working environment with suitable temperature and humidity (recommended temperature: 23~25℃, about 55% relative humidity) to achieve complete curing.
Dry, cool, avoid direct sunlight, no more than 35℃.