Edgebanding Polyurethane Hot Melt Adhesives Foam PUR Hot Glue Particle Chip Density Aluminum PUR-XCS637

Edgebanding Polyurethane Hot Melt Adhesives Foam PUR Hot Glue Particle Chip Density Aluminum PUR-XCS637

Product Details:

Place of Origin: CHINA
Brand Name: WANLI-ADHESION
Certification: ISO9001 ISO14001 IATF16949
Model Number: PUR-XCS637

Payment & Shipping Terms:

Minimum Order Quantity: 20 KG
Packaging Details: 500~2000g/Bag, 20Kg/Barrel, 200Kg/Barrel
Delivery Time: 5-8 work days
Payment Terms: L/C, T/T
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Detail Information

Product: PUR Hot Melt Adhesive Component: PUR (Polyurethane)
Appearance: Ivory Solid Solid Content: 100%
Shelf Life: 6 Months Melt Viscosity: About 55000mPa·s@120℃
Operating Temperature: 120 ~140 ℃ Open Time: 10~15s@25℃
Useage Scope: Edge Bonding Of Wood Material S- Chip Board Application Industry: Woodworking Edgebanding
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Product Description

Single-component reactive adhesive PUR-XCS637 is colorless transparent after melting and suitable for edgebanding application of all colors substrates. It can cure within short time at room temperature and provide an invisible bondline due to their colorless appearance to meet end customer demands on perfect glueline.

 
Wanli® PUR hot melt adhesive PUR-XCS637 for edge bonding is a single-component reactive PUR hot melt adhesive with 100% solid content. PUR-XCS637 is a translucent natural color edge bonding glue, which is mainly used for edge bonding of solid wood materials, density boards, foam boards, particleboards and other substrates. PUR-XCS637 is featured high initial tack, short open time, high bond strength.
 
APPLICATION
Wanli® PUR hot melt adhesive PUR-XCS637 is used for edge bonding. PUR-XCS637 is mainly used edge bonding of solid wood materials, density boards, foam boards, particleboards and other substrates.

 

Application Material Woodworking Edgebanding Hot Melt Adhesives
Appearance Ivory Solid
Component PUR (Polyurethane)
Application Industry Woodworking Edgebanding
Solid Content 100%
Operating Temperature 120~140 ℃( Depend On Machine, Substrate, Environment And Other Conditions)
Melt Viscosity About 55000mPa·s@120℃(Brookfield-ASTMD3236)
Open Time 10~15s@25℃
Usage Scope Edge Bonding of Wood Materials - Chip Board
Shelf Life 6 Months
Package 500~2000g/Bag, 20Kg/Barrel, 200Kg/Barrel

 
FEATURE
High initial tack.
Short open time.
High bond strength.
 
USER GUIDE
The package of PUR-XCS637 is suitable for various dispensing equipment.
The recommended operating temperature is 120℃~140℃.
It is better to place finished product in a working environment with suitable temperature and humidity (recommended temperature: 23~25℃, about 55% relative humidity) to achieve complete curing.
 
STORAGE
Dry, cool, avoid direct sunlight, no more than 35℃.

 

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