Electronics Hot Melt Adhesive Electrical Structural Bonding PUR-8830
|Place of Origin:||CHINA|
|Certification:||ISO9001 ISO14001 IATF16949|
Payment & Shipping Terms:
|Minimum Order Quantity:||30ml|
|Packaging Details:||30ml/Plastic Tube|
|Delivery Time:||5-8 work days|
|Payment Terms:||L/C, T/T|
|Product:||PUR Hot Melt Adhesive||Component:||PUR(Polyurethane)|
|Appearance:||Ivory White Solids||Solid Content:||100 %|
|Shelf Life:||6 Months||Melt Viscosity:||3000~6000cps@110℃|
|Operating Temperature:||About 110℃||Open Time:||3~5 Minutes@25℃|
|Useage Scope:||Electronics Coils Bonding||Application Industry:||Electronics Structural Bonding|
Electronics Hot Melt Adhesives PUR-8830,
Electrical Structural Bonding Hot Melt Adhesives,
PUR 8830 Bonding Hot Melt Adhesives
Factory Direct Supply Ivory-White 100% Solid Reactive PUR Hot Melt Adhesive WANLI® PUR-8830 with Open Time 3~5 Minutes at 25℃ for Electrical Structural Bonding, Perfect Bonding Strength
Wanli® PUR hot melt adhesive PUR-8830 for electronics structural bonding is a single-component reactive PUR hot melt adhesive with 100% solid content. It can be used for self-adhesion and mutual adhesion of PC, ABS, PVC and other plastics and aluminum, stainless steel and other metals. It is featured stable viscosity under heating at a certain temperature, high initial bonding strength and final bonding strength. After curing, it has good peeling strength, good heat&humidity resistance and chemical resistance. It is especially suitable for bonding applications in the electronic industry.
Wanli® PUR hot melt adhesive PUR-8830 is used for electronics structural bonding. It can be used for self-adhesion and mutual adhesion of PC, ABS, PVC and other plastics and aluminum, stainless steel and other metals. It is especially suitable for bonding applications in the electronic industry.
|Application Material||Electrical Structural Bonding PUR Hot Melt Adhesives|
|Appearance||Ivory White Solid|
|Application Industry||Electronics Structural Bonding|
|Operating Temperature||About 110℃( Depend On Machine, Substrate, Environment And Other Conditions)|
|Curing||Normal Temperature Curing|
|Usage Scope||Electronics Coils Bonding|
|Shelf Life||6 Months|
Stable viscosity under heating at a certain temperature.
High initial bonding strength and final bonding strength.
After curing, it has good peeling strength, good heat&humidity resistance and chemical resistance.
The package of PUR-8830 is suitable for various dispensing equipment. The recommended operating temperature is about 110℃. In order to achieve complete curing, it is better to place finished product in a working environment with suitable temperature and humidity (recommended temperature: 23~25℃, about 65% relative humidity).
Store the product where it’s dry, cool and avoid direct sunlight. The storage temperature should be no more than 35℃ and avoid open fire or heat source.