• Electronics Hot Melt Adhesive Electrical Structural Bonding PUR-8830
  • Electronics Hot Melt Adhesive Electrical Structural Bonding PUR-8830
  • Electronics Hot Melt Adhesive Electrical Structural Bonding PUR-8830
  • Electronics Hot Melt Adhesive Electrical Structural Bonding PUR-8830
  • Electronics Hot Melt Adhesive Electrical Structural Bonding PUR-8830
Electronics Hot Melt Adhesive Electrical Structural Bonding PUR-8830

Electronics Hot Melt Adhesive Electrical Structural Bonding PUR-8830

Product Details:

Place of Origin: CHINA
Brand Name: WANLI-ADHESION
Certification: ISO9001 ISO14001 IATF16949
Model Number: PUR-8830

Payment & Shipping Terms:

Minimum Order Quantity: 30ml
Packaging Details: 30ml/Plastic Tube
Delivery Time: 5-8 work days
Payment Terms: L/C, T/T
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Detail Information

Product: PUR Hot Melt Adhesive Component: PUR(Polyurethane)
Appearance: Ivory White Solids Solid Content: 100 %
Shelf Life: 6 Months Melt Viscosity: 3000~6000cps@110℃
Operating Temperature: About 110℃ Open Time: 3~5 Minutes@25℃
Useage Scope: Electronics Coils Bonding Application Industry: Electronics Structural Bonding
Highlight:

Electronics Hot Melt Adhesives PUR-8830

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Electrical Structural Bonding Hot Melt Adhesives

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PUR 8830 Bonding Hot Melt Adhesives

Product Description

Factory Direct Supply Ivory-White 100% Solid Reactive PUR Hot Melt Adhesive WANLI® PUR-8830 with Open Time 3~5 Minutes at 25℃ for Electrical Structural Bonding, Perfect Bonding Strength

 

Wanli® PUR hot melt adhesive PUR-8830 for electronics structural bonding is a single-component reactive PUR hot melt adhesive with 100% solid content. It can be used for self-adhesion and mutual adhesion of PC, ABS, PVC and other plastics and aluminum, stainless steel and other metals. It is featured stable viscosity under heating at a certain temperature, high initial bonding strength and final bonding strength. After curing, it has good peeling strength, good heat&humidity resistance and chemical resistance. It is especially suitable for bonding applications in the electronic industry.

 

APPLICATION

Wanli® PUR hot melt adhesive PUR-8830 is used for electronics structural bonding. It can be used for self-adhesion and mutual adhesion of PC, ABS, PVC and other plastics and aluminum, stainless steel and other metals. It is especially suitable for bonding applications in the electronic industry.

 

Application Material Electrical Structural Bonding PUR Hot Melt Adhesives
Appearance Ivory White Solid
Component PUR (Polyurethane)
Application Industry Electronics Structural Bonding
Solid Content 100%
Operating Temperature About 110℃( Depend On Machine, Substrate, Environment And Other Conditions)
Melt Viscosity 3000~6000cps@110℃(Brookfield-ASTMD3236)
Open Time 3~5min@25℃
Curing Normal Temperature Curing
Usage Scope Electronics Coils Bonding
Shelf Life 6 Months
Package 30ml/Plastic Tube

 

FEATURE

Stable viscosity under heating at a certain temperature.

High initial bonding strength and final bonding strength.

After curing, it has good peeling strength, good heat&humidity resistance and chemical resistance.

 

USER GUIDE

The package of PUR-8830 is suitable for various dispensing equipment. The recommended operating temperature is about 110℃. In order to achieve complete curing, it is better to place finished product in a working environment with suitable temperature and humidity (recommended temperature: 23~25℃, about 65% relative humidity).

 

STORAGE

Store the product where it’s dry, cool and avoid direct sunlight. The storage temperature should be no more than 35℃ and avoid open fire or heat source.

 

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