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200 ℃ Wood Materials Edgebanding Hot Melt Adhesive Woodworking Chip Board EVA-JF-108
Product Details:
| Place of Origin: | CHINA |
| Brand Name: | WANLI-ADHESION |
| Certification: | ISO9001 ISO14001 IATF16949 |
| Model Number: | EVA-JF-108 |
Payment & Shipping Terms:
| Minimum Order Quantity: | 25 KG |
|---|---|
| Packaging Details: | 25Kg/Bag |
| Delivery Time: | 5-8 work days |
| Payment Terms: | L/C, T/T |
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Detail Information |
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| Product: | EVA Hot Melt Adhesive | Component: | EVA(Ethylene-Vinyl Acetate) |
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| Appearance: | White Round Particles | Solid Content: | 100% |
| Shelf Life: | 2 Years | Melt Viscosity: | 70000±10000mpa·s(under 200℃) |
| Softening Temperature: | 100±5℃ | Operating Temperature: | 180～200℃ |
| Usage Scope: | Edge Bonding Of Wood Materials- Chip Board | Application Industry: | Woodworking Edgebanding |
| High Light: | Edgebanding Hot Melt Adhesive Chip Board,200 ℃ Edgebanding Hot Melt Adhesive,Wood Materials Edgebanding Hot Melt Adhesive |
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Product Description
Hot Selling Online Shop EVA Hot Melt Adhesive WANLI® EVA-JF-108 with Viscosity 70000±10000mpa·s (200℃) for Chip Board Edge Bonding with Lower Cost
Wanli® EVA hot melt adhesive JF-108 for edge bonding is a ethylene-vinyl acetate copolymer with 100% solid content. It is specifically developed for bonding of chip board to various kinds of edge band. It is featured high bonding strength, lower cost and fast curing.
APPLICATION
Wanli® EVA hot melt adhesive JF-108 is used for bonding of chip board to various kinds of edge band.
| Application Material | Woodworking Edgebanding Hot Melt Adhesives |
| Appearance | White particles |
| Component | EVA(Ethylene-Vinyl Acetate) |
| Application Industry | Woodworking Edgebanding |
| Solid Content | 100% |
| Operating Temperature | 180～200 ℃( Depend On Machine, Substrate, Environment And Other Conditions). |
| Softening Temperature | 100±5 ℃ |
| Melt Viscosity | 70000±10000mpa·s (200℃) |
| Curing | Normal Temperature Curing |
| Usage Scope | Edge Bonding of Wood Materials- Chip Board |
| Shelf Life | 2 Years |
| Package | 25Kg/Bag |
FEATURE
High bonding strength, lower cost and fast curing
USER GUIDE
The package of JF-108 is suitable for various dispensing equipment. The recommended operating temperature is 180℃~200℃, which depends on the equipment, substrate and environment and other conditions.
STORAGE
Store indoors and do not expose to extreme weather conditions (e.g. rain or exposure to sunlight). The storage temperature should be no more than 35℃ and avoid open fire or heat source.
