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Chip Woodworking Edgebanding Hot Melt Adhesive Ivory PUR Glue PUR-7562.1
Product Details:
| Place of Origin: | CHINA |
| Brand Name: | WANLI-ADHESION |
| Certification: | ISO9001 ISO14001 IATF16949 |
| Model Number: | PUR-7562.1 |
Payment & Shipping Terms:
| Minimum Order Quantity: | 20 KG |
|---|---|
| Packaging Details: | 500~2000g/Bag, 20Kg/Barrel, 200Kg/Barrel |
| Delivery Time: | 5-8 work days |
| Payment Terms: | L/C, T/T |
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Detail Information |
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| Product: | PUR Hot Melt Adhesive | Component: | PUR (Polyurethane) |
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| Appearance: | Ivory / Solid | Solid Content: | 100 Percent |
| Shelf Life: | 6 Months | Melt Viscosity: | About 75000 MPa·s@120℃ |
| Operating Temperature: | 120~140 ℃ | Open Time: | 8~15s@25℃ |
| Useage Scope: | Edge Bonding Of Wood Materials- Chip Board | Application Industry: | Reactive PUR Hot Melt Adhesive For Woodworking Edgebanding |
| Highlight: | chip edgebanding hot melt adhesive,woodworking edgebanding hot melt adhesive,ivory pur glue |
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Product Description
Good Quality Factory Directly WANLI® PUR-7562.1 Ivory 100% Solid Reactive PUR Hot Melt Adhesive for Chip Board Edge Bonding During High Quality Furniture Production
Wanli® PUR hot melt adhesive PUR-7562.1 for edge bonding is a single-component reactive PUR hot melt adhesive with 100% solid content. PUR-7562.1 is mainly used for edge bonding of wooded materials(chip board) to various surface materials. PUR-7562.1 is featured good initial adhesion, suitable opening time, high bonding strength.
APPLICATION
Wanli® PUR hot melt adhesive PUR-7562.1 is used for edge bonding. PUR-7562.1 is mainly used for edge bonding of wooded materials(chip board) to various surface materials.
| Application Material | Woodworking Edgebanding Hot Melt Adhesives |
| Appearance | Ivory / Solid |
| Component | PUR (Polyurethane) |
| Application Industry | Reactive PUR Hot Melt Adhesive for Woodworking Edgebanding |
| Solid Content | 100 Percent |
| Operating Temperature | 120~140 ℃ |
| Melt Viscosity | About 75000mPa·s@120℃(Brookfield-ASTMD3236) |
| Open Time | 8~15s@25℃ |
| Usage Scope | Edge Bonding of Wood Materials- Chip Board |
| Shelf Life | 6 Months |
| Package | 500~2000g/Bag, 20Kg/Barrel, 200Kg/Barrel |
FEATURE
Very good initial adhesion.
Suitable opening time.
High bonding strength.
USER GUIDE
The package of PUR-7562.1 is suitable for various dispensing equipment. The recommended operating temperature is 120℃~140℃. In order to achieve complete curing, it is better to place finished product in a working environment with suitable temperature and humidity (recommended temperature: 23~25℃, about 55% relative humidity).
STORAGE
Store the product where it’s dry, cool and avoid direct sunlight. The storage temperature should be no more than 35℃ and avoid open fire or heat source.
