White Solid Hot Melt Glue For Edge Banding , Woodworking PUR Glue For Edgebander PUR-7563A
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New Hot Selling WANLI® PUR-7563A White 100% Solid Reactive PUR Hot Melt Adhesive for Chip Board Edge Bonding in Fast And Flexible Production Processes
Wanli® PUR hot melt adhesive PUR-7563A for edge bonding is a single-component reactive PUR hot melt adhesive with 100% solid content. PUR-7563A is a cleaning free glue, which is mainly used for edge bonding of solid wooded materials(chip board) to various surface materials. PUR-7563A is featured stable viscosity under heating at a certain temperature, short open time, high initial bonding strength, high final bonding strength and no cleaning.
APPLICATION
Wanli® PUR hot melt adhesive PUR-7563A is used for edge bonding. PUR-7563A is mainly used for edge bonding of solid wooded materials(chip board) to various surface materials.
| Application Material | Woodworking Edgebanding Hot Melt Adhesives |
| Appearance | White Solid |
| Component | PUR (Polyurethane) |
| Application Industry | Woodworking Edgebanding |
| Solid Content | 100% |
| Operating Temperature | 120~140 ℃ |
| Melt Viscosity | Approximate 65000cps@120℃(Brookfield-ASTMD3236) |
| Open Time | Approximate 10s@25℃ |
| Usage Scope | Edge Bonding of Wood Materials - Chip Board |
| Shelf Life | 6·Months |
| Package | 500~2000g/Bag, 20Kg/Barrel, 200Kg/Barrel |
FEATURE
Stable viscosity under heating at a certain temperature.
Short open time.
High initial bonding strength.
High final bonding strength.
No cleaning.
USER GUIDE
The package of PUR-7563A is suitable for various dispensing equipment.
The recommended operating temperature is 120℃~140℃.
In order to achieve complete curing, it is better to place finished product in a working environment with suitable temperature and humidity (recommended temperature: 23~25℃, about 65% relative humidity).
STORAGE
Dry, cool, avoid direct sunlight, no more than 35℃.
