Foam PUR Hot Melt Adhesives Woodworking Aluminum PUR-7562.1

Foam PUR Hot Melt Adhesives Woodworking Aluminum PUR-7562.1

Product Details:

Place of Origin: CHINA
Brand Name: WANLI-ADHESION
Certification: ISO9001 ISO14001 IATF16949
Model Number: PUR-7562.1

Payment & Shipping Terms:

Minimum Order Quantity: 20 KG
Packaging Details: 500~2000g/Bag, 20Kg/Barrel, 200Kg/Barrel
Delivery Time: 5-8 work days
Payment Terms: L/C, T/T
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Detail Information

Product: PUR Hot Melt Adhesive Component: PUR (Polyurethane)
Appearance: Ivory Solid Solid Content: 100%
Shelf Life: 6 Months Melt Viscosity: About 75000mPa·s@120℃
Operating Temperature: 120~140 ℃ Open Time: 8~15s@25℃
Useage Scope: Edge Bonding Of Wood Material S- Chip Board Application Industry: Woodworking Edgebanding
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Product Description

PUR hotmelt adhesive PUR-7562.1 are particularly suitable for fast and flexible production processes due to their short processing time in edge banding. PUR hot melt adhesives are renowned for meeting the highest demands with regard to a zero-bondline appearance as well as resistance to heat, moisture and chemicals in kitchens and bathrooms

 

 Wanli® PUR hot melt adhesive PUR-7562.1 for edge bonding is a single-component reactive PUR hot melt adhesive with 100% solid content. PUR-7562.1 is mainly used for edge bonding of wood materials, foam boards, and some aluminum substrates. PUR-7562.1 is featured good initial adhesion, suitable opening time, high bonding strength.
 
APPLICATION
Wanli® PUR hot melt adhesive PUR-7562.1 is used for edge bonding. PUR-7562.1 is mainly used for edge bonding of wood materials, foam boards, and some aluminum substrates.

 

Application Material Woodworking Edgebanding Hot Melt Adhesives
Appearance Ivory Solid
Component PUR (Polyurethane)
Application Industry Woodworking Edgebanding
Solid Content 100%
Operating Temperature 120~140 ℃( Depend On Machine, Substrate, Environment And Other Conditions)
Melt Viscosity About 75000mPa·s@120℃(Brookfield-ASTMD3236)
Open Time 8~15s@25℃
Usage Scope Edge Bonding of Wood Material s- Chip Board
Shelf Life 6 Months
Package 500~2000g/Bag, 20Kg/Barrel, 200Kg/Barrel

 
FEATURE
Good initial adhesion.
Suitable opening time.
High bonding strength.
 
USER GUIDE
The package of PUR-7562.1 is suitable for various dispensing equipment.
The recommended operating temperature is 120℃~140℃.
It is better to place finished product in a working environment with suitable temperature and humidity to achieve complete curing (recommended temperature: 23~25℃, about 55% relative humidity).
 
STORAGE
Dry, cool, avoid direct sunlight, no more than 35℃.

 

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