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Hot Melt Phone Glue For Electronic Components Black Polyurethane PUR Adhesives PUR-8854H
Product Details:
| Place of Origin: | CHINA |
| Brand Name: | WANLI-ADHESION |
| Certification: | ISO9001 ISO14001 IATF16949 |
| Model Number: | PUR-8854H |
Payment & Shipping Terms:
| Minimum Order Quantity: | 310 ml |
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| Packaging Details: | 310ml/Aluminium Tube |
| Delivery Time: | 5-8 work days |
| Payment Terms: | L/C, T/T |
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Detail Information |
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| Product: | PUR Hot Melt Adhesive | Component: | PUR (Polyurethane) |
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| Appearance: | Black Solid | Solid Content: | 100% |
| Shelf Life: | 6 Months | Melt Viscosity: | 3500~5500cps@100℃ |
| Operating Temperature: | About 110℃ | Open Time: | 4-7 Min@25℃ |
| Optical Density(T=0.1mm): | 4.3 | Useage Scope: | Phone Watchs Components Bonding |
| Application Industry: | Electronics Components Bonding | ||
| High Light: | hot melt glue for electronic components,phone glue for electronic components,black polyurethane pur hot melt adhesives |
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Product Description
Factory Supply Hot Melt Adhesives PUR-8854H for Electronic Components Bonding
Wanli® hot melt adhesive PUR-8854H for electronics components bonding is a single-component reactive PUR hot melt adhesive with 100% solid content. PUR-8854H can be used for self-adhesion and mutual adhesion of PC, ABS, PVC and other plastics and aluminum, stainless-steel and others. PUR-8854H has stable viscosity under heating at a certain temperature, high initial bonding strength and final bonding strength. After curing, PUR-8854H has good peeling strength/ heat & humidity resistance and chemical resistance. PUR-8854H is awesomely suitable for bonding applications in the electronic industry.
APPLICATION
Wanli® PUR hot melt adhesive PUR-8854H is used for electronics components bonding. PUR-8854H can be used for self-adhesion and mutual adhesion of PC, ABS, PVC and other plastics and aluminum, stainless steel and other metals. PUR-8854H is especially suitable for bonding applications in the electronic industry.
| Application Material | Electronic Components Bonding Hot Melt Adhesive |
| Appearance | Black Solid |
| Component | PUR (Polyurethane) |
| Application Industry | Electronics Components Bonding |
| Solid Content | 100% |
| Operating Temperature | About 110℃ |
| Melt Viscosity | 3500~5500 cps@100℃ (Brookfield-ASTMD3236) |
| Open Time | 4-7min@25℃ |
| Optical Density(T=0.1mm) | 4.3 |
| Usage Scope | Phone Watch Components Bonding |
| Shelf Life | 6 Months |
| Package | 310 ml/Aluminium Tube |
FEATURE
Stable viscosity under heating at a certain temperature.
High initial bonding strength and final bonding strength.
It has good peeling strength, good heat & humidity resistance and chemical resistance after curing.
USER GUIDE
The package of PUR-8854H is suitable for various dispensing equipment.
The recommended operating temperature is about 110℃.
In order to achieve complete curing, it is better to place finished product in a working environment with suitable temperature and humidity (recommended temperature: 23~25℃, recommended relative humidity: about 65%).
STORAGE
Store where it’s dry, cool and avoid direct sunlight. The storage temperature should be no more than 35℃ and avoid open fire or heat source.
