• Assembly Bonding Polyurethane Hot Melt Adhesives Earphone Circuit Board Glue PUR-8860
  • Assembly Bonding Polyurethane Hot Melt Adhesives Earphone Circuit Board Glue PUR-8860
  • Assembly Bonding Polyurethane Hot Melt Adhesives Earphone Circuit Board Glue PUR-8860
  • Assembly Bonding Polyurethane Hot Melt Adhesives Earphone Circuit Board Glue PUR-8860
  • Assembly Bonding Polyurethane Hot Melt Adhesives Earphone Circuit Board Glue PUR-8860
Assembly Bonding Polyurethane Hot Melt Adhesives Earphone Circuit Board Glue PUR-8860

Assembly Bonding Polyurethane Hot Melt Adhesives Earphone Circuit Board Glue PUR-8860

Product Details:

Place of Origin: CHINA
Brand Name: WANLI-ADHESION
Certification: ISO9001 ISO14001 IATF16949
Model Number: PUR-8860

Payment & Shipping Terms:

Minimum Order Quantity: 30 ml
Packaging Details: 30 ml/Plastic Tube
Delivery Time: 5-8 work days
Payment Terms: L/C, T/T
Get Best Price Contact Now

Detail Information

Product: PUR Hot Melt Adhesive Component: PUR (Polyurethane)
Appearance: Ivory White Solid Solid Content: 100%
Shelf Life: 6 Months Melt Viscosity: 2000~4000 Cps@110℃
Operating Temperature: About 110℃ Open Time: 2~4 Min@25℃
Density: 1.06 G/cm3 Useage Scope: TWS (True Wireless Stereo) Earphone Assembly
Application Industry: Electronics Earphone Assembly Bonding
High Light:

assembly polyurethane hot melt adhesives

,

bonding polyurethane hot melt adhesives

,

earphone circuit board glue

Product Description

Good Quality Factory Directly Earphone Assembly Bonding Hot Melt Adhesives PUR-8860

 
 Wanli® PUR hot melt adhesive PUR-8860 for earphone assembly bonding is a single-component reactive PUR hot melt adhesive with 100% solid content. PUR-8860 can be used for self-adhesion and mutual adhesion of PC, ABS, PVC and other plastics and aluminum, stainless steel and other metals. PUR-8860 is featured stable viscosity under heating at a certain temperature, high initial bonding strength and final bonding strength. After curing, it has good peeling strength, good heat&humidity resistance and chemical resistance. PUR-8860 is especially suitable for bonding applications in the electronic industry.
 
APPLICATION
Wanli® PUR hot melt adhesive PUR-8860 is used for earphone assembly bonding. Which can be used for self-adhesion and mutual adhesion of PC, ABS, PVC and other plastics and aluminum, stainless steel and other metals. PUR-8860 is especially suitable for bonding applications in the electronic industry.

 
Application Material Earphone Assembly Bonding
Appearance Ivory White Solid
Component PUR (Polyurethane)
Application Industry Electronics Earphone Assembly Bonding
Solid Content 100%
Operating Temperature About 110℃( Depend On Machine, Substrate, Environment And Other Conditions)
Melt Viscosity 2000~4000cps@110℃(Brookfield-ASTMD3236)
Open Time 2~4min@25℃
Density 1.06g/cm3
Usage Scope TWS(True Wireless Stereo) Earphone Assembly
Shelf Life 6 Months
Package 30ml/Plastic Tube

 
FEATURE
PUR-8860 has stable viscosity.
High initial and final bonding strength when heated at a certain temperature.
It has good peel strength, good heat resistance, moisture resistance and chemical resistance after curing.
 
USER GUIDE
The package of PUR-8860 is suitable for various dispensing equipment.
The recommended operating temperature is about 110℃.
In order to complete curing, it is better to place finished product in a working environment with suitable temperature and humidity (recommended temperature: 23~25℃, about 65% relative humidity).
 
STORAGE
Store the product in a dry, cool place away from direct sunlight. The storage temperature shall not exceed 35 ℃, and avoid open fire or heat source.

 

Assembly Bonding Polyurethane Hot Melt Adhesives Earphone Circuit Board Glue PUR-8860 0 Assembly Bonding Polyurethane Hot Melt Adhesives Earphone Circuit Board Glue PUR-8860 1

Want to Know more details about this product
I am interested in Assembly Bonding Polyurethane Hot Melt Adhesives Earphone Circuit Board Glue PUR-8860 could you send me more details such as type, size, quantity, material, etc.
Thanks!
Waiting for your reply.