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The wonderful use of hot melt adhesives

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September 27, 2022
Category Connection: PUR Hot Melt Adhesives
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Tags:
#chip low temperature hot melt glue #edgebanding low temperature hot melt glue #white polypropylene hot glue
Brief: Discover the wonderful use of hot melt adhesives with Wanli® PUR-XBB768, a high-performance chip edgebanding low-temperature hot melt glue. Perfect for woodworking edgebanding, this white polypropylene adhesive offers superior bonding strength and a flawless finish for high-quality furniture.
Related Product Features:
  • Moisture-curing reactive adhesive PUR-XBB768 ensures superior bonding strength and high-quality appearance.
  • Single-component reactive PUR hot melt adhesive with 100% solid content.
  • Ideal for edge bonding of wood materials, foam boards, and some aluminum substrates.
  • Features good initial adhesion, suitable opening time, and high bonding strength.
  • Operating temperature range of 120~140℃ for optimal performance.
  • Melt viscosity of about 55000mPa*s@120℃ for smooth application.
  • Open time of 8~15s@25℃ for efficient workflow.
  • Shelf life of 6 months when stored in dry, cool conditions.
Faqs:
  • What materials can PUR-XBB768 be used for edge bonding?
    PUR-XBB768 is mainly used for edge bonding of wood materials, foam boards, and some aluminum substrates.
  • What is the recommended operating temperature for PUR-XBB768?
    The recommended operating temperature for PUR-XBB768 is 120℃~140℃, depending on machine, substrate, and environmental conditions.
  • How should PUR-XBB768 be stored to maintain its quality?
    PUR-XBB768 should be stored in a dry, cool place, avoiding direct sunlight and temperatures exceeding 35℃ to ensure a shelf life of 6 months.
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